Assorted sandwiches, pastries and snacks displayed in recyclable cardboard platter boxes promoting Sabert and Colpac’s new sustainable platter ranges – text reads ‘New Platter Ranges, Explore.
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19th IC & Sensor Packaging Technology Expo

19th IC & Sensor Packaging Technology Expo

Date

17 Jan 2018 - 19 Jan 2018

Location

Tokyo Big Sight,Japan

Organizer

Reed Exhibitions Japan Ltd

Email

isp@reedexpo.co.jp

Website

http://www.reedexpo.co.jp

Image
Assorted sandwiches, pastries and snacks displayed in recyclable cardboard platter boxes promoting Sabert and Colpac’s new sustainable platter ranges – text reads ‘New Platter Ranges, Explore.
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