Name: IC Packaging Technology Expo
Start: 2010-01-20T00:00:00
End: 2010-01-22T00:00:00
Location: Tokyo International Exhibition Center (Tokyo Big Sight) 3-21-1 Ariake, Koto-ku, Tokyo, Japan

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Connected packaging: Experts spotlight regulatory, next-gen barcode & branding opportunities

Assorted sandwiches, pastries and snacks displayed in recyclable cardboard platter boxes promoting Sabert and Colpac’s new sustainable platter ranges – text reads ‘New Platter Ranges, Explore.

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Events

IC Packaging Technology Expo

Date

20 Jan - 22 Jan, 2010

Location

Tokyo International Exhibition Center (Tokyo Big S...

Organizer

Reed Exhibitions Japan Limited

inw-e@reedexpo.co.jp

Website

http://www.icp-expo.jp/en/

Sealed Air banner showing food packaging with sauces and fries, featuring the text: ‘Smarter Packaging. Confident Service.’ and logos for Cryovac and Liquibox by Sealed Air.

Upcoming events

DEC

2025

EBC25

Berlin and online

JAN

2026

Pharmapack Europe 2026

Paris Expo, Porte de Versailles – Hall 4

FEB

2026

Packaging Innovations & Empack 2026

NEC, Birmingham, UK

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