Name: IC Packaging Technology Expo
Start: 2015-01-14T00:00:00
End: 2015-01-16T00:00:00
Location: Tokyo International Exhibition Center, Japan

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Assorted sandwiches, pastries and snacks displayed in recyclable cardboard platter boxes promoting Sabert and Colpac’s new sustainable platter ranges – text reads ‘New Platter Ranges, Explore.

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Events

IC Packaging Technology Expo

Date

14-16 Jan 2015

Location

Tokyo International Exhibition Center, Japan

Organizer

Reed Exhibitions Japan Ltd.

info@reedexhibitions.com

Website

www.reedexpo.co.jp/en/

Sealed Air banner showing food packaging with sauces and fries, featuring the text: ‘Smarter Packaging. Confident Service.’ and logos for Cryovac and Liquibox by Sealed Air.

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